Transfer, Assembly, and Embedding of Small CMOS-Die Arrays for the Build-Up of Flexible Smart Implants

Heid, Andreas; de Andrade, Marcio Camoleze; Bleck, Lena; von Metzen, Rene P.; Kern, Dieter; Giehl, Juergen; Bucher, Volker

dc.contributor.author	Heid, Andreas
dc.contributor.author	Bleck, Lena
dc.contributor.author	Metzen, René von
dc.contributor.author	Kern, Dieter P.
dc.date.accessioned	2020-03-13T15:10:53Z
dc.date.available	2020-03-13T15:10:53Z
dc.date.issued	2019
dc.identifier.issn	2156-3985
dc.identifier.uri	http://hdl.handle.net/10900/99053
dc.language.iso	en	de_DE
dc.publisher	IEEE - Inst Electrical Electronics Engineers Inc	de_DE
dc.relation.uri	http://dx.doi.org/10.1109/TCPMT.2019.2900564	de_DE
dc.subject.ddc	600	de_DE
dc.title	Transfer, Assembly, and Embedding of Small CMOS-Die Arrays for the Build-Up of Flexible Smart Implants	de_DE
dc.type	Article	de_DE
utue.quellen.id	20190926111821_00722
utue.publikation.seiten	1415-1425	de_DE
utue.personen.roh	Heid, Andreas
utue.personen.roh	de Andrade, Marcio Camoleze
utue.personen.roh	Bleck, Lena
utue.personen.roh	von Metzen, Rene P.
utue.personen.roh	Kern, Dieter
utue.personen.roh	Giehl, Juergen
utue.personen.roh	Bucher, Volker
dcterms.isPartOf.ZSTitelID	IEEE Transactions on Components Packaging and Manufacturing Technology	de_DE
dcterms.isPartOf.ZS-Issue	7	de_DE
dcterms.isPartOf.ZS-Volume	9	de_DE
utue.fakultaet	04 Medizinische Fakultät	de_DE
utue.fakultaet	07 Mathematisch-Naturwissenschaftliche Fakultät	de_DE