Transfer, Assembly, and Embedding of Small CMOS-Die Arrays for the Build-Up of Flexible Smart Implants

DSpace Repository

Transfer, Assembly, and Embedding of Small CMOS-Die Arrays for the Build-Up of Flexible Smart Implants

Author: Heid, Andreas; de Andrade, Marcio Camoleze; Bleck, Lena; von Metzen, Rene P.; Kern, Dieter; Giehl, Juergen; Bucher, Volker
Tübinger Autor(en):
Heid, Andreas
Bleck, Lena
von Metzen, Rene P.
Kern, Dieter P.
Published in: IEEE Transactions on Components Packaging and Manufacturing Technology (2019), Bd. 9, H. 7, S. 1415-1425
Verlagsangabe: IEEE - Inst Electrical Electronics Engineers Inc
Language: English
Full text: http://dx.doi.org/10.1109/TCPMT.2019.2900564
ISSN: 2156-3985
DDC Classifikation: 600 - Technology
Dokumentart: Artikel
Show full item record

This item appears in the following Collection(s)