Simulative Comparison of Polymer and Ceramic Encapsulation on SiC-MOSFET Power Modules under Thermomechanical Load

dc.contributor.author	Käßner, Stefan
dc.date.accessioned	2019-09-06T10:53:52Z
dc.date.available	2019-09-06T10:53:52Z
dc.date.issued	2019
dc.identifier.uri	http://hdl.handle.net/10900/92570
dc.language.iso	en	de_DE
dc.publisher	IEEE : 20th EuroSimE, 24-27 March, Hannover, Germany	de_DE
dc.relation.uri	10.1109/EuroSimE.2019.8724587	de_DE
dc.subject.ddc	500	de_DE
dc.subject.ddc	550	de_DE
dc.subject.ddc	600	de_DE
dc.subject.ddc	620	de_DE
dc.subject.ddc	621.3	de_DE
dc.title	Simulative Comparison of Polymer and Ceramic Encapsulation on SiC-MOSFET Power Modules under Thermomechanical Load	de_DE
dc.type	ConferenceObject	de_DE
utue.personen.roh	Wagner, Felix