Simulative Comparison of Polymer and Ceramic Encapsulation on SiC-MOSFET Power Modules under Thermomechanical Load

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Simulative Comparison of Polymer and Ceramic Encapsulation on SiC-MOSFET Power Modules under Thermomechanical Load

Author: Wagner, Felix
Tübinger Autor(en):
Käßner, Stefan
Issue year: 2019
Verlagsangabe: IEEE : 20th EuroSimE, 24-27 March, Hannover, Germany
Language: English
Full text: 10.1109/EuroSimE.2019.8724587
DDC Classifikation: 500 - Natural sciences and mathematics
550 - Earth sciences
600 - Technology
620 - Engineering and allied operations
621.3 - Electric, electronic, magnetic, communications, computer engineering; lighting
Dokumentart: ConferenceObject
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