Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power Density

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dc.contributor.author Käßner, Stefan
dc.contributor.author Nickel, Klaus G.
dc.date.accessioned 2019-09-06T10:52:23Z
dc.date.available 2019-09-06T10:52:23Z
dc.date.issued 2018
dc.identifier.isbn 978-1-5386-4999-2
dc.identifier.issn 2377-5726
dc.identifier.uri http://hdl.handle.net/10900/92568
dc.language.iso en de_DE
dc.publisher In: IEEE 68th Electronic Components and Technology Conference, ECTC 2018, 29 May - 1 June 2018, San Diego, California. Proceedings: Piscataway, NJ: IEEE, 2018, S. 1258–1269. de_DE
dc.relation.uri de_DE
dc.relation.uri https://doi.org/10.1109/ECTC.2018.00194 de_DE
dc.subject Encapsulation de_DE
dc.subject Power electronics de_DE
dc.subject Multichip modules de_DE
dc.subject Temperature de_DE
dc.subject Thermomechanical processes de_DE
dc.subject Substrates de_DE
dc.subject Reliability de_DE
dc.subject Automotive and power electronics packaging de_DE
dc.subject materials for harsh environments de_DE
dc.subject cement based encapsulation de_DE
dc.subject failure analysis techniques and materials characterization de_DE
dc.subject high temperature electronics de_DE
dc.subject.classification Verkapselung , Leistungselektronik , Zuverlässigkeit , Keramik , Verbundwerkstoff , Zement de_DE
dc.subject.ddc 500 de_DE
dc.subject.ddc 550 de_DE
dc.subject.ddc 600 de_DE
dc.subject.ddc 620 de_DE
dc.subject.ddc 621.3 de_DE
dc.title Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power Density de_DE
dc.type ConferenceObject de_DE
utue.personen.roh Böttge, Bianca


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