Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power Density

dc.contributor.author	Käßner, Stefan
dc.contributor.author	Nickel, Klaus G.
dc.date.accessioned	2019-09-06T10:52:23Z
dc.date.available	2019-09-06T10:52:23Z
dc.date.issued	2018
dc.identifier.isbn	978-1-5386-4999-2
dc.identifier.issn	2377-5726
dc.identifier.uri	http://hdl.handle.net/10900/92568
dc.language.iso	en	de_DE
dc.publisher	In: IEEE 68th Electronic Components and Technology Conference, ECTC 2018, 29 May - 1 June 2018, San Diego, California. Proceedings: Piscataway, NJ: IEEE, 2018, S. 1258–1269.	de_DE
dc.relation.uri		de_DE
dc.relation.uri	https://doi.org/10.1109/ECTC.2018.00194	de_DE
dc.subject	Encapsulation	de_DE
dc.subject	Power electronics	de_DE
dc.subject	Multichip modules	de_DE
dc.subject	Temperature	de_DE
dc.subject	Thermomechanical processes	de_DE
dc.subject	Substrates	de_DE
dc.subject	Reliability	de_DE
dc.subject	Automotive and power electronics packaging	de_DE
dc.subject	materials for harsh environments	de_DE
dc.subject	cement based encapsulation	de_DE
dc.subject	failure analysis techniques and materials characterization	de_DE
dc.subject	high temperature electronics	de_DE
dc.subject.classification	Verkapselung , Leistungselektronik , Zuverlässigkeit , Keramik , Verbundwerkstoff , Zement	de_DE
dc.subject.ddc	500	de_DE
dc.subject.ddc	550	de_DE
dc.subject.ddc	600	de_DE
dc.subject.ddc	620	de_DE
dc.subject.ddc	621.3	de_DE
dc.title	Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power Density	de_DE
dc.type	ConferenceObject	de_DE
utue.personen.roh	Böttge, Bianca

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