Author: | Böttge, Bianca; ... | |
Tübinger Autor(en): |
|
|
Issue year: | 2018 | |
Verlagsangabe: | In: IEEE 68th Electronic Components and Technology Conference, ECTC 2018, 29 May - 1 June 2018, San Diego, California. Proceedings: Piscataway, NJ: IEEE, 2018, S. 1258–1269. | |
Language: | English | |
Full text: |
https://doi.org/10.1109/ECTC.2018.00194 |
|
ISSN: | 2377-5726 | |
ISBN: | 978-1-5386-4999-2 | |
DDC Classifikation: |
500 - Natural sciences and mathematics 550 - Earth sciences 600 - Technology 620 - Engineering and allied operations 621.3 - Electric, electronic, magnetic, communications, computer engineering; lighting |
|
Keywords: | Verkapselung , Leistungselektronik , Zuverlässigkeit , Keramik , Verbundwerkstoff , Zement | |
Dokumentart: | ConferenceObject | |
Show full item record |