Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power Density

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Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power Density

Author: Böttge, Bianca; ...
Tübinger Autor(en):
Käßner, Stefan
Nickel, Klaus G.
Issue year: 2018
Verlagsangabe: In: IEEE 68th Electronic Components and Technology Conference, ECTC 2018, 29 May - 1 June 2018, San Diego, California. Proceedings: Piscataway, NJ: IEEE, 2018, S. 1258–1269.
Language: English
Full text: 10.1109/ECTC.2018.00194
ISSN: 2377-5726
ISBN: 978-1-5386-4999-2
DDC Classifikation: 500 - Natural sciences and mathematics
550 - Earth sciences
600 - Technology
620 - Engineering and allied operations
621.3 - Electric, electronic, magnetic, communications, computer engineering; lighting
Keywords: Verkapselung , Leistungselektronik , Zuverlässigkeit , Keramik , Verbundwerkstoff , Zement
Dokumentart: Konferenzveröffentlichung
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