Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging

dc.contributor.author	Käßner, Stefan
dc.contributor.author	Nickel, Klaus G.
dc.date.accessioned	2019-08-27T06:00:49Z
dc.date.available	2019-08-27T06:00:49Z
dc.date.issued	2018
dc.identifier.uri	http://hdl.handle.net/10900/91936
dc.language.iso	en	de_DE
dc.relation.uri	https://doi.org/10.4071/imaps.661015	de_DE
dc.subject	Materialwissenschaft	de_DE
dc.subject.classification	Elektronik	de_DE
dc.subject.ddc	620	de_DE
dc.title	Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging	de_DE
dc.type	Article	de_DE
utue.publikation.seiten	132-139	de_DE
utue.personen.roh	Käßner, Stefan
dcterms.isPartOf.ZSTitelID	Journal of Microelectronics and Electronic Packaging	de_DE
dcterms.isPartOf.ZS-Volume	15	de_DE
utue.fakultaet	07 Mathematisch-Naturwissenschaftliche Fakultät	de_DE