Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging

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Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging

Author: Käßner, Stefan; ...
Tübinger Autor(en):
Käßner, Stefan
Nickel, Klaus G.
Published in: Journal of Microelectronics and Electronic Packaging (2018), Bd. 15, S. 132-139
Language: English
Full text: https://doi.org/10.4071/imaps.661015
DDC Classifikation: 620 - Engineering and allied operations
Keywords: Elektronik
Dokumentart: Artikel
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