Author: | Käßner, Stefan; ... | |
Tübinger Autor(en): |
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Published in: |
Journal of Microelectronics and Electronic Packaging
(2018), Bd.
15,
S.
132-139 |
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Language: | English | |
Full text: | https://doi.org/10.4071/imaps.661015 | |
DDC Classifikation: | 620 - Engineering and allied operations | |
Keywords: | Elektronik | |
Dokumentart: | Artikel | |
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