Resolution and sensitivity of wafer-level multi-aperture cameras

dc.contributor.author	Lensch, Hendrik P. A.	de_DE
dc.date.accessioned	2013-12-04T09:29:31Z
dc.date.available	2013-12-04T09:29:31Z
dc.date.issued	2013	de_DE
dc.identifier.issn	1017-9909	de_DE
dc.identifier.uri	http://hdl.handle.net/10900/38674
dc.language.iso	en	en
dc.publisher	Is&t & Spie	de_DE
dc.relation.uri	http://dx.doi.org/10.1117/1.JEI.22.1.011001	de_DE
dc.rights	info:eu-repo/semantics/closedAccess
dc.subject.ddc	600	de_DE
dc.subject.ddc	530	de_DE
dc.subject.ddc	610	de_DE
dc.title	Resolution and sensitivity of wafer-level multi-aperture cameras	de_DE
dc.type	Article	de_DE
utue.quellen.id	20130911224530_02227	de_DE
utue.personen.roh	Oberdoerster, Alexander	de_DE
utue.personen.roh	Lensch, Hendrik P. A.	de_DE
dcterms.isPartOf.ZSTitelID	Journal of Electronic Imaging	de_DE
dcterms.isPartOf.ZS-Issue	Article 011001	de_DE
dcterms.isPartOf.ZS-Volume	22	de_DE
utue.fakultaet	Universität Tübingen (ohne Fakultätsangabe)	de_DE