Connecting and Encapsulation Technology for Active Middle Ear Implants

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Connecting and Encapsulation Technology for Active Middle Ear Implants

Author: Tavakoli, K.; Kaltenbacher, D.; Winter, M.; Zenner, H-P; Burkhardt, C.
Tübinger Autor(en):
Zenner, Hans-Peter
Burkhardt, Claus
Tavakoli, Kia
Published in: Biomedical Engineering - Biomedizinische Technik (2012), Bd. 57, H. Suppl. 1
Verlagsangabe: Walter De Gruyter & Co
Language: English
Full text: http://dx.doi.org/10.1515/bmt-2012-4440
ISSN: 0013-5585
DDC Classifikation: 004 - Data processing and computer science
600 - Technology
610 - Medicine and health
Dokumentart: Article
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