Quantifying flux residues after soldering on technical copper using ultraviolet visible (UV-Vis) spectroscopy and multivariate analysis

Author:

Englert, Tim; Stiedl, Jan; Green, Simon; Jacob, Timo; Chasse, Thomas; Rebner, Karsten

Tübinger Autor(en):

Published in:

Microelectronics Reliability (2021), Bd. 125, Article 114367

Verlagsangabe:

Pergamon - Elsevier Science Ltd

Language:

English

Full text:

ISSN:

1872-941X

DDC Classifikation:

530 - Physics
540 - Chemistry and allied sciences
600 - Technology

Dokumentart:

Article

This item appears in the following Collection(s)